Silicon Wafer Cutting Diamond Wire Blade
Diamond cutting wire blade is a flexible cutting tool in which the wire is processed into closed loop and coated with diamond grains on the surface. The diamond cutting wire features small diameter and strong cutting toughness, which makes precision cutting possible, and is an advanced cutting tool at present.
Caratteristiche
- Continuous diamond coating on wire surface
- Customized grain size
- Backing material made of alloyed special steel, stainless steel
- High cutting efficiency (speed up to 60m/s)
- High cutting precision
- Long blade-life
- Low electricity consumption
- No cooling lubricant
Parameters
| Diameter (mm) | Grain Size | Tensile Strength (N) | Loop Length (mm) |
| 0.42 | 200/230 | 80-100 | 1000-10000 |
| 0.50 | 170/200, 200/230 | 100-120 | 1000-10000 |
| 0.60 | 140/170, 170/200 | 100-120 | 1000-10000 |
| 0.65 | 140/170, 170/200 | 100-120 | 1000-10000 |
| 0.80 | 120/140, 140/170 | 180-200 | 1000-10000 |
| 1.50 | 120/140, 140/170 | 200-300 | 2500-10000 |
| 1.80 | 120/140, 140/170 | 200-300 | 2500-10000 |
General Information
Product Name: Silicon Wafer Cutting Diamond Wire Blade
Material: Tungsten wire
Applications: Silicon ingot, silicon wafer
Min Order: 200
Samples: Free at our cost
Metodo di spedizione: via mare, via aerea, DHL, UPS, FedEx, ecc.
Porto di spedizione: Shanghai, Cina
